Hard And Brittle Materials Precision Cutting Solutions

Our diamond cutting wheels provide clean, precise and low-chipping cutting solutions for glass, technical ceramics, quartz, sapphire, carbide, ferrite and semiconductor materials. Metal, resin and electroplated bond systems can be selected according to the required cutting speed, edge quality, kerf width and tool life. Continuous-rim and ultra-thin diamond blades help reduce material loss and improve dimensional consistency in precision slicing, slotting and dicing operations.

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Who Uses This Solution?

Suitable for:

Optical Glass Manufacturers
Technical Ceramic Manufacturers
Semiconductor Wafer Manufacturers
Sapphire Processing Companies
Quartz and Fused Silica Processors
Electronic Substrate Manufacturers
Ferrite and Magnetic Material Manufacturers
Precision Material Cutting Laboratories

Recommended Processing Applications

Optical Glass

Provides clean cutting of lenses, prisms, optical windows and other precision glass components.

Technical Ceramics

Suitable for cutting alumina, zirconia, silicon nitride and silicon carbide components with reduced edge chipping.

Quartz and Fused Silica

Produces straight, stable cuts in quartz tubes, plates and precision optical components.

Sapphire Components

Used for precision slicing and dicing of sapphire windows, substrates and optical parts.

Semiconductor Wafers

Provides high-precision slicing and dicing of silicon, silicon carbide and semiconductor packages.

Ferrite and Magnetic Materials

Suitable for narrow-kerf cutting and slotting of ferrite cores, magnetic components and electronic materials.

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